Tinning flux Activator#

The most important development criterion here: to minimise contamination by the flux. The EF250 flux is the latest product in the EF series. It is characterised above all by a fine-pored foam crown. The flux EF270F is the optimised variant for application by foam fluxer. The fluxes of the EF200 series are more weakly activated and show their strengths in the area of full tunnel nitrogen systems, as they leave less residue on the PCB due to their lower solid content. In direct comparison to the flux EF330, the flux EF350 increases the insulation resistance of the flux residues through a small addition of resins and at the same time reduces the formation of solder beads. The EF fluxes have in common that a high to very high electrical safety is guaranteed with varying small residue quantities on the soldered PCBs. Thus, all requirements of current electronics production can be covered.

Tinning flux Activator#

Within the completely halogen-free EF series, fluxes can be found both with and without resin or with the smallest amounts of activator up to very broadband fluxes. The reliability of the No-Clean flux and its residues after soldering also play an important role in selecting the right flux. For soldering on older systems and on surfaces that are difficult to solder, a higher activation should be used. For a full-tunnel nitrogen system, for example, a very low activation can be considered.

This means that the optimum activation can be selected for each process – depending on solderability and reliability requirements. The EF fluxes are available with different activation levels. A large part of the series, for example, has been especially developed for application with current spray flux systems. The products of the EF series meet these requirements, not least due to their great variety and wide range of applications. The electronics manufacturing industry places high demands on modern flux systems.